Invention Grant
- Patent Title: High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards
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Application No.: US14692559Application Date: 2015-04-21
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Publication No.: US10129976B2Publication Date: 2018-11-13
- Inventor: Daniel J. Braley , Eric G. Barnes , Pedro Gonzalez
- Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
- Applicant Address: US VA Falls Church
- Assignee: Northrop Grumman Systems Corporation
- Current Assignee: Northrop Grumman Systems Corporation
- Current Assignee Address: US VA Falls Church
- Agency: Shumaker, Loop & Kendrick, LLP
- Agent John A. Miller
- Main IPC: B29C64/00
- IPC: B29C64/00 ; H05K1/09 ; H05K1/03 ; H05K3/46 ; B33Y80/00 ; H05K3/10 ; B33Y70/00 ; B29C64/106 ; H05K3/12 ; B29K23/00 ; B29K305/00 ; B29L31/34
Abstract:
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
Public/Granted literature
- US20160316556A1 HIGH PERFORMANCE, ULTRA LOW LOSS, ULTRA LIGHTWEIGHT, MULTI-LAYERED RIGID CIRCUIT BOARDS Public/Granted day:2016-10-27
Information query
