Invention Grant
- Patent Title: Heat radiation adhesive, heat radiation sheet using same, and electronic device having same
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Application No.: US15319160Application Date: 2015-06-25
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Publication No.: US10130002B2Publication Date: 2018-11-13
- Inventor: Seung Jae Hwang
- Applicant: AMOGREENTECH CO., LTD.
- Applicant Address: KR Gimpo-si
- Assignee: AMOGREENTECH CO., LTD.
- Current Assignee: AMOGREENTECH CO., LTD.
- Current Assignee Address: KR Gimpo-si
- Agency: Cantor Colburn LLP
- Priority: KR10-2014-0078739 20140626
- International Application: PCT/KR2015/006505 WO 20150625
- International Announcement: WO2015/199467 WO 20151230
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C09J11/04 ; C09J9/00 ; B32B7/12 ; B32B27/08 ; B32B27/20 ; C09J7/00 ; H05K1/02 ; H05K1/18 ; C09J7/20 ; C08K7/04 ; C08K7/18
Abstract:
Provided are a heat-radiating adhesive member, a heat-radiating sheet using the heat-radiating adhesive member, and an electronic apparatus having the heat-radiating sheet. The heat-radiating adhesive member includes: an adhesive layer; first thermally conductive fillers that are dispersed inside the adhesive layer and spreads heat generated from a heat-generating component of an electronic apparatus in a horizontal direction of the adhesive layer; and second thermally conductive fillers that are dispersed inside the adhesive layer and transfer the heat generated from the heat-generating component of the electronic apparatus to the first thermally conductive fillers.
Public/Granted literature
- US20170137674A1 HEAT RADIATION ADHESIVE, HEAT RADIATION SHEET USING SAME, AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2017-05-18
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