Invention Grant
- Patent Title: Memory device including a redundancy column and a redundancy peripheral logic circuit
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Application No.: US15699412Application Date: 2017-09-08
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Publication No.: US10134486B2Publication Date: 2018-11-20
- Inventor: Hoonki Kim , Yongho Kim , Changnam Park , Taejoong Song , Woojin Rim , Jonghoon Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0118062 20160913; KR10-2017-0070958 20170607
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C7/10 ; G11C29/26 ; G11C5/02

Abstract:
A memory device includes a memory cell array including a plurality of memory cells arranged in a plurality of columns including a normal column and a redundancy column for repairing the normal column, a plurality of peripheral logic circuits including a normal peripheral logic circuit and a redundancy peripheral logic circuit for repairing the normal peripheral logic circuit, and a first path selection logic circuit configured to form first paths between the plurality of columns and the plurality of peripheral logic circuits, based on at least one defect from among a defect in at least one of the plurality of columns or a defect in at least one of the plurality of peripheral logic circuits.
Public/Granted literature
- US20180075929A1 MEMORY DEVICE INCLUDING A REDUNDANCY COLUMN AND A REDUNDANCY PERIPHERAL LOGIC CIRCUIT Public/Granted day:2018-03-15
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