Invention Grant
- Patent Title: Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus
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Application No.: US14579292Application Date: 2014-12-22
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Publication No.: US10134614B2Publication Date: 2018-11-20
- Inventor: Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2004-159520 20040528
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01N29/44 ; B24B9/06 ; B24B49/12 ; G01N21/95

Abstract:
A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
Public/Granted literature
- US20150101752A1 SUBSTRATE PERIPHERAL PORTION MEASURING DEVICE, AND SUBSTRATE PERIPHERAL PORTION POLISHING APPARATUS Public/Granted day:2015-04-16
Information query
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