Invention Grant
- Patent Title: Printed circuit board, package substrate comprising same, and method for manufacturing same
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Application No.: US15117373Application Date: 2015-01-28
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Publication No.: US10134679B2Publication Date: 2018-11-20
- Inventor: Dong Sun Kim , Sung Wuk Ryu , Ji Haeng Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2014-0013469 20140206
- International Application: PCT/KR2015/000909 WO 20150128
- International Announcement: WO2015/119397 WO 20150813
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/10 ; H01L25/00 ; H05K3/34 ; H01L23/498 ; H01L21/48 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H05K3/40
Abstract:
The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.
Public/Granted literature
- US20160351506A1 PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE COMPRISING SAME, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-12-01
Information query
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