A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on first surface of the lowermost layer, a conductor post having upper surface facing the first surface of the lowermost layer, a metal post formed such that the metal post is protruding from second surface of the lowermost layer and is positioned at lower surface of the conductor post, an electronic component embedded in the lowermost layer such that the component is positioned on second surface side of the lowermost layer and has an electrode facing the first surface of the lowermost layer, and via conductors formed in the lowermost layer and including first and second via conductors such that the first via conductor is connecting the first conductor layer and the upper surface of the conductor post and the second via conductor is connecting the first conductor layer and the electrode of the component.