- Patent Title: Fin field effect transistor (FET) (FinFET) complementary metal oxide semiconductor (CMOS) circuits employing single and double diffusion breaks for increased performance
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Application No.: US15197949Application Date: 2016-06-30
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Publication No.: US10134734B2Publication Date: 2018-11-20
- Inventor: Jun Yuan , Yanxiang Liu , Kern Rim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Withrow & Terranova, PLLC
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L21/8238 ; H01L21/762 ; H01L21/02 ; H01L21/306 ; H01L21/28 ; H01L29/49

Abstract:
Fin Field Effect Transistor (FET) (FinFET) complementary metal oxide semiconductor (CMOS) circuits with single and double diffusion breaks for increased performance are disclosed. In one aspect, a FinFET CMOS circuit employing single and double diffusion breaks includes a P-type FinFET that includes a first Fin formed from a semiconductor substrate and corresponding to a P-type diffusion region. The FinFET CMOS circuit includes an N-type FinFET that includes a second Fin formed from the semiconductor substrate and corresponding to an N-type diffusion region. To electrically isolate the P-type FinFET, first and second single diffusion break (SDB) isolation structures are formed in the first Fin on either side of a gate of the P-type FinFET. To electrically isolate the N-type FinFET, first and second double diffusion break (DDB) isolation structures are formed in the second Fin on either side of a gate of the N-type FinFET.
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