A semiconductor chip includes: a first conductive line formed in a first conductive layer, a second conductive line formed in a second conductive layer, and a third conductive line formed in a third conductive layer; wherein the first conductive line is longer than the second conductive line substantially along a first direction, the second conductive line is longer than the first conductive line and the third conductive line substantially along a second direction, the third conductive line is longer than the second conductive line substantially along the first direction, the first conductive layer has a thickness which is thicker than that of the second conductive layer, and the third conductive layer has a thickness which is substantially equal to or thicker than that of the first conductive layer.