Invention Grant
- Patent Title: Semiconductor device having a dielectric layer with different thicknesses and method for forming
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Application No.: US15456963Application Date: 2017-03-13
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Publication No.: US10134860B2Publication Date: 2018-11-20
- Inventor: Jan Sonsky , Viet Thanh Dinh , Jan Claes
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes a first dielectric layer on a substrate, the first dielectric layer including a first dielectric portion over a first doped well region of a first conductivity type and a second dielectric portion over a second doped well region of a second conductivity type, and a second dielectric layer on the substrate directly adjacent the first dielectric layer. The second dielectric layer is over the second doped well region. A first conductive gate structure is over the first and second dielectric layers. A third dielectric layer is on the substrate over the second doped well region and separated a first distance from the second dielectric layer. A second conductive gate structure is over the third dielectric layer. A third doped region of the second conductivity type is implanted in the second doped well region a second distance from the third dielectric layer and the second conductive gate structure.
Public/Granted literature
- US20180261676A1 SEMICONDUCTOR DEVICE HAVING A DIELECTRIC LAYER WITH DIFFERENT THICKNESSES AND METHOD FOR FORMING Public/Granted day:2018-09-13
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