- Patent Title: Vertical field effect transistors with bottom source/drain epitaxy
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Application No.: US15726678Application Date: 2017-10-06
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Publication No.: US10134874B2Publication Date: 2018-11-20
- Inventor: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini Bianco PL
- Agent Thomas S. Grzesik
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/417 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L21/02 ; H01L21/3065

Abstract:
A vertical fin field-effect-transistor and a method for fabricating the same. The vertical fin field-effect-transistor includes a substrate, a first source/drain layer including a plurality of pillar structures, and a plurality of fins disposed on and in contact with the plurality of pillar structures. A doped layer epitaxially grown from the first source/drain layer is in contact with the plurality of fins and the plurality of pillar structures. A gate structure is disposed in contact with two or more fins in the plurality of fins. The gate structure includes a dielectric layer and a gate layer. A second source/drain layer is disposed on the gate structure. The method includes epitaxially growing a doped layer in contact with a plurality of fins and a plurality of pillar structures. A gate structure is formed in contact with two or more fins. A second source/drain layer is formed on the gate structure.
Public/Granted literature
- US20180033869A1 VERTICAL FIELD EFFECT TRANSISTORS WITH BOTTOM SOURCE/DRAIN EPITAXY Public/Granted day:2018-02-01
Information query
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