Invention Grant
- Patent Title: Cyclic deposition etch chemical vapor deposition epitaxy to reduce EPI abnormality
-
Application No.: US13782112Application Date: 2013-03-01
-
Publication No.: US10134896B2Publication Date: 2018-11-20
- Inventor: Chun Hsiung Tsai , Sheng-Wen Yu , Ying-Min Chou , Yi-Fang Pai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L29/66

Abstract:
A semiconductor substructure with an improved source/drain structure is described. The semiconductor substructure can include an upper surface; a gate structure formed over the substrate; a spacer formed along a sidewall of the gate structure; and a source/drain structure disposed adjacent the gate structure. The source/drain structure is disposed over or on a recess surface of a recess that extends below said upper surface. The source/drain structure includes a first epitaxial layer, having a first composition, over or on the interface surface, and a subsequent epitaxial layer, having a subsequent composition, over or on the first epitaxial layer. A dopant concentration of the subsequent composition is greater than a dopant concentration of the first composition, and a carbon concentration of the first composition ranges from 0 to 1.4 at.-%. Methods of making semiconductor substructures including improved source/drain structures are also described.
Public/Granted literature
- US20140246710A1 CYCLIC DEPOSITION ETCH CHEMICAL VAPOR DEPOSITION EPITAXY TO REDUCE EPI ABNORMALITY Public/Granted day:2014-09-04
Information query
IPC分类: