Invention Grant
- Patent Title: Memory device and method for fabricating the same
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Application No.: US15596733Application Date: 2017-05-16
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Publication No.: US10134918B2Publication Date: 2018-11-20
- Inventor: Jean-Pierre Colinge , Ta-Pen Guo , Carlos H. Diaz
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L27/11521 ; H01L29/66 ; H01L29/775 ; H01L29/792 ; H01L27/11519 ; H01L27/11556 ; H01L27/11565 ; H01L27/11582 ; H01L21/28 ; B82Y10/00 ; H01L29/40 ; H01L29/423 ; H01L29/06

Abstract:
A method includes patterning a substrate to form a nanowire over the substrate, applying a plurality of doping processes to the nanowire to form a first drain/source region at a lower portion of the nanowire, a second drain/source region at an upper portion of the nanowire and a channel region, wherein the channel region is between the first drain/source region and the second drain/source region, depositing a first dielectric layer along sidewalls of the channel region, depositing a control gate layer over the first dielectric layer, wherein the control gate layer surrounds a lower portion of the channel region, depositing a second dielectric layer along the sidewalls of the channel region and over the control gate layer and forming a floating gate region surrounding an upper portion of the channel region.
Public/Granted literature
- US20170250288A1 Memory Device and Method for Fabricating the Same Public/Granted day:2017-08-31
Information query
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