Invention Grant
- Patent Title: High-speed data communications connector
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Application No.: US15419987Application Date: 2017-01-30
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Publication No.: US10135207B2Publication Date: 2018-11-20
- Inventor: Wenbo Cui , Jon Clark Riley , Bret Taylor , Kenn Peterson , Stephen M. Morton , Phil R. Mansur , Ryan C. Moore
- Applicant: Leviton Manufacturing Co., Inc.
- Applicant Address: US NY Melville
- Assignee: LEVITON MANUFACTURING CO., INC.
- Current Assignee: LEVITON MANUFACTURING CO., INC.
- Current Assignee Address: US NY Melville
- Agency: Davis Wright Tremaine LLP
- Agent George C. Rondeau, Jr.; Heather M. Colburn
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R24/62 ; H01G4/38 ; H01R13/6466 ; H01R13/66 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H01G4/40 ; H01R13/6461 ; H01R12/58 ; H01R24/64 ; H01R107/00

Abstract:
A communication plug configured to be mated with a communication outlet. The plug has first contacts configured to physically contact and form electrical connections with second contacts of the outlet. The plug also includes a substrate with wire contacts and first, second, third, and fourth layers. The first layer includes first conductors connecting a first portion of the first contacts with a first portion of the wire contacts. The fourth layer includes second conductors connecting a second portion of the first contacts with a second portion of the wire contacts. The second layer includes a first plurality of capacitor plates electrically connected to first selected ones of the first contacts. The third layer includes a second plurality of capacitor plates electrically connected to second selected ones of the first contacts. Each of the first plurality of capacitor plates forms a capacitor with at least one of the second plurality of capacitor plates.
Public/Granted literature
- US20170222375A1 HIGH-SPEED DATA COMMUNICATIONS CONNECTOR Public/Granted day:2017-08-03
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