Invention Grant
- Patent Title: Electronic device housing and manufacturing method thereof by die-casting an aluminum alloy
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Application No.: US15552236Application Date: 2015-08-31
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Publication No.: US10135959B2Publication Date: 2018-11-20
- Inventor: Zhen Tang , Xi Fan , Shoude Xie , Changming Wang , Yunbin Li , Kaifu Liu , Shenghui Zhou , Xu Lu
- Applicant: DONGGUAN JANUS PRECISION COMPONENTS COMPANY LIMITED , DONGGUAN JANUS ELECTRONIC PRECISION COMPONENTS CO., LTD
- Applicant Address: CN Guangdong CN Guangdong
- Assignee: GUANGDONG JANUS INTELLIGENT GROUP CORP., LTD,DONGGUAN JANUS ELECTRONIC PRECISION COMPONENTS CO. LTD.
- Current Assignee: GUANGDONG JANUS INTELLIGENT GROUP CORP., LTD,DONGGUAN JANUS ELECTRONIC PRECISION COMPONENTS CO. LTD.
- Current Assignee Address: CN Guangdong CN Guangdong
- Agency: Weiss & Moy, P.C.
- Agent Jeffrey D. Moy
- Priority: CN201510359913 20150624
- International Application: PCT/CN2015/088598 WO 20150831
- International Announcement: WO2016/206189 WO 20161229
- Main IPC: H04M1/02
- IPC: H04M1/02
Abstract:
An electronic device housing (100) comprises outer frame (10) and a die casting inner frame (20). The die casting inner frame is shaped by means of die casting and is jogged in the outer frame. The present invention also comprises a method for manufacturing the electronic device housing.
Public/Granted literature
- US20180109657A1 ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREFOR Public/Granted day:2018-04-19
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