Invention Grant
- Patent Title: Substrate processing apparatus and substrate transfer method
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Application No.: US15690025Application Date: 2017-08-29
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Publication No.: US10141211B2Publication Date: 2018-11-27
- Inventor: Toshio Yokoyama , Masahiko Sekimoto , Kenichi Kobayashi , Kenichi Akazawa , Takashi Mitsuya , Keiichi Kurashina
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2014-059565 20140324
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/687

Abstract:
A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.
Public/Granted literature
- US20170358472A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD Public/Granted day:2017-12-14
Information query
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