Invention Grant
- Patent Title: Thin film stack
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Application No.: US14418003Application Date: 2012-07-31
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Publication No.: US10141497B2Publication Date: 2018-11-27
- Inventor: James Elmer Abbott, Jr. , Peter Mardilovich , Stephen F. Bylund , Christopher Shelton
- Applicant: James Elmer Abbott, Jr. , Peter Mardilovich , Stephen F. Bylund , Christopher Shelton
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2012/048992 WO 20120731
- International Announcement: WO2014/021850 WO 20140206
- Main IPC: H01L41/08
- IPC: H01L41/08 ; B41J2/14 ; H01L41/09 ; H01L41/319
Abstract:
The present disclosure is drawn to a thin film stack including a substrate, a metal layer, and an adhesive layer. The adhesive layer comprises a blend of zinc oxide and tin oxide, and the adhesive layer is adhered between the substrate and the metal layer.
Public/Granted literature
- US20150228886A1 THIN FILM STACK Public/Granted day:2015-08-13
Information query
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