Invention Grant
- Patent Title: Pattern antenna
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Application No.: US15870041Application Date: 2018-01-12
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Publication No.: US10141637B2Publication Date: 2018-11-27
- Inventor: Koji Asakawa
- Applicant: MegaChips Corporation
- Applicant Address: JP Osaka-shi
- Assignee: MegaChips Corporation
- Current Assignee: MegaChips Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-167131 20150826
- Main IPC: H01Q5/00
- IPC: H01Q5/00 ; H01Q1/36 ; H01Q1/48 ; H01Q1/38 ; H01Q9/30 ; H01Q1/24

Abstract:
A pattern antenna, with excellent broadband antenna characteristics, that is formed in a small area is provided. The pattern antenna includes a substrate, a first ground portion formed on a first surface of the substrate, an antenna element portion, a protruding and short-circuiting portion, and a second ground portion. The antenna element portion includes a conductor pattern in which a plurality of bent portions are formed. The conductor pattern is formed on the first surface of the substrate and is electrically connected to the first ground portion. The protruding and short-circuiting portion includes a taper portion with a tapered shape, a protruding portion, and an extended portion extended toward a side opposite to a feed point as viewed in planar view. The second ground portion, with no contact with the taper portion, with such a shape that sandwiches at least a part of a tapered section of the taper portion as viewed in planar view.
Public/Granted literature
- US20180138588A1 PATTERN ANTENNA Public/Granted day:2018-05-17
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