Invention Grant
- Patent Title: Support device for printed circuit board
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Application No.: US15522945Application Date: 2016-04-12
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Publication No.: US10143078B2Publication Date: 2018-11-27
- Inventor: Lei Cao , Nannan Hu , Zifeng Wang , She Lin , Yan Ren
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201620106211U 20160202
- International Application: PCT/CN2016/079047 WO 20160412
- International Announcement: WO2017/133078 WO 20170810
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/02 ; G02F1/1333 ; H05K9/00
Abstract:
A support device for a printed circuit board includes a plate body and a shielding cover formed integrally with the plate body, the plate body is provided with an opening and a mounting structure for mounting a printed circuit board, the shielding cover is formed from an extension of a side wall of the opening and covers the printed circuit board.
Public/Granted literature
- US20180070445A1 SUPPORT DEVICE FOR PRINTED CIRCUIT BOARD Public/Granted day:2018-03-08
Information query
