Invention Grant
- Patent Title: Pre-formed thermoplastic filler for thermoset structure
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Application No.: US14045483Application Date: 2013-10-03
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Publication No.: US10144203B2Publication Date: 2018-12-04
- Inventor: Gabriel Z. Forston , Christopher G. Harris , Joshua P. Tyndall , Hyukbong Kwon , Carolyn Schmidt
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kunzler, PC
- Main IPC: B32B7/00
- IPC: B32B7/00 ; B32B27/04 ; B32B27/08 ; B32B5/28 ; B64C1/06 ; B64C1/12 ; B32B27/20 ; B29C70/86 ; B29C70/08 ; B32B7/06 ; B29C65/00 ; B64C1/00 ; B29L31/30

Abstract:
An apparatus includes a first thermoset layer that includes a first fibrous material embedded in a first thermoset matrix. The apparatus also includes a second thermoset layer that includes a second fibrous material embedded in a second thermoset matrix. The second thermoset layer is coupled to the first thermoset layer to form a joint. Further, a gap is defined between the first thermoset layer and the second thermoset layer. The apparatus also includes a thermoplastic filler that is made from a thermoplastic material. The thermoplastic filler is positioned within the gap.
Public/Granted literature
- US20150099096A1 PRE-FORMED THERMOPLASTIC FILLER FOR THERMOSET STRUCTURE Public/Granted day:2015-04-09
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