Invention Grant
- Patent Title: One-component curable resin composition
-
Application No.: US14913431Application Date: 2014-08-18
-
Publication No.: US10144799B2Publication Date: 2018-12-04
- Inventor: Ryo Ogawa , Takuya Matsuda
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Millen White Zelano and Branigan, PC
- Agent John Sopp
- Priority: JP2013-173454 20130823
- International Application: PCT/JP2014/004195 WO 20140818
- International Announcement: WO2015/025505 WO 20150226
- Main IPC: C08G59/66
- IPC: C08G59/66 ; C08G59/24 ; C08G59/50 ; C08G59/56

Abstract:
A one-component curable resin composition that does not contain an isocyanate compound, comprised of uniformly blended (A) a compound having two or more epoxy groups within a molecule, (B) a compound having two or more thiol groups within a molecule, and (C) an imidazole compound of formula (I), wherein the component (C) exists in the form of liquid.
Public/Granted literature
- US20160200860A1 ONE-COMPONENT CURABLE RESIN COMPOSITION Public/Granted day:2016-07-14
Information query
IPC分类: