Invention Grant
- Patent Title: Dihydropyrrolo[2,3-F] indole-diketopyrrolopyrrole semiconducting materials, and methods and uses thereof
-
Application No.: US15850567Application Date: 2017-12-21
-
Publication No.: US10144800B2Publication Date: 2018-12-04
- Inventor: Mingqian He , Jieyu Hu , Adama Tandia , Weijun Niu
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Jason A. Barron; Shantanu C. Pathak
- Main IPC: C07D519/00
- IPC: C07D519/00 ; C08G61/12 ; H01L51/00 ; H01L51/05 ; H01L51/50
![Dihydropyrrolo[2,3-F] indole-diketopyrrolopyrrole semiconducting materials, and methods and uses thereof](/abs-image/US/2018/12/04/US10144800B2/abs.jpg.150x150.jpg)
Abstract:
Described herein are heterocyclic organic compounds. More specifically, described herein are compounds based on the combination of fused pyrrole structures with diketopyrrolopyrrole structures, methods for making these compounds, and uses thereof. The compounds disclosed have improved electronic, polymerization and stability properties that allow for improved material processibility and inclusion in organic semiconductor devices.
Public/Granted literature
Information query