Invention Grant
- Patent Title: Intermodulation sensor platform based on mechanical resonator
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Application No.: US14402697Application Date: 2013-05-22
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Publication No.: US10145729B2Publication Date: 2018-12-04
- Inventor: Ville Viikari , Heikki Seppä
- Applicant: Teknologian tutkimuskeskus VTT
- Applicant Address: FI Espoo
- Assignee: Teknologian tutkimuskeskus VTT Oy
- Current Assignee: Teknologian tutkimuskeskus VTT Oy
- Current Assignee Address: FI Espoo
- Agency: Seppo Laine Oy
- International Application: PCT/FI2013/050561 WO 20130522
- International Announcement: WO2013/175073 WO 20131128
- Main IPC: G01H13/00
- IPC: G01H13/00 ; H04B1/28

Abstract:
The present invention related to a new passive wireless sensor platform which is based on the intermodulation communication principle. The platform may utilize a quartz crystal or other mechanical resonator. Additionally, the platform allows for a narrow bandwidth and/or ID-code of a sensor. Certain embodiments enable high frequencies and large read-out distances. It facilitates a generic sensor element and can thus be used to monitor virtually any quantity. Additionally, it offers a means to realize a wireless passive sensor using MEMS sensor technology.
Public/Granted literature
- US20150128707A1 Intermodulation sensor platform based on mechanical resonator Public/Granted day:2015-05-14
Information query
IPC分类:
G | 物理 |
G01 | 测量;测试 |
G01H | 机械振动或超声波、声波或次声波的测量 |
G01H13/00 | 测量谐振(共振)频率 |