Invention Grant
- Patent Title: Physical quantity measuring device including a sensor module and a joint for locking the sensor module
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Application No.: US15363184Application Date: 2016-11-29
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Publication No.: US10145749B2Publication Date: 2018-12-04
- Inventor: Yusuke Abe , Shuji Tohyama , Haruhiko Sekiya
- Applicant: NAGANO KEIKI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee: NAGANO KEIKI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2015-235138 20151201
- Main IPC: G01L19/14
- IPC: G01L19/14 ; G01L9/00

Abstract:
A physical quantity measuring device includes: a sensor module provided with a diaphragm; a joint to which the sensor module is attached, the joint including a pressure inlet for delivering fluid to be measured to the sensor module. The joint is made of a synthetic resin and includes a joint body and an elastically deformable claw provided to the joint body and configured to lock the sensor module. Since the claw keeps the sensor module to be held by virtue of the elastic force of the claw, a further attachment process such as welding for attaching the sensor module to the joint is unnecessary. Since the joint body and the claw are integrally made of synthetic resin, it is not necessary to separately manufacture the joint body and the claw.
Public/Granted literature
- US20170153157A1 PHYSICAL QUANTITY MEASURING DEVICE Public/Granted day:2017-06-01
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