Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first die including a first switch circuit that receives a plurality of data signals, and further provides the plurality of data signals to a plurality of corresponding first ports among a plurality of first data ports and a first data redundancy port; and a second die including a second switch circuit that receives the plurality of data signals from the first die at a plurality of corresponding second ports among a plurality of second data ports and a second data redundancy port and further provides the plurality of data signals to a memory array.