An integrated circuit is provided. The integrated circuit includes a package base including package leads, an extracted die removed from a previous packaged integrated circuit, and an an interposer bonded to the extracted die and the package base. The extracted die includes original bond pads and one or more original ball bonds on the original bond pads. The interposer includes first bond pads electrically connected to the original bond pads with 3D printed first bond connections conforming to the shapes and surfaces of the extracted die and the interposer and second bond pads electrically connected to the package leads with 3D printed second bond connections conforming to shapes and surfaces of the interposer and package base.