Invention Grant
- Patent Title: Array substrate, method of manufacturing the same, and display device
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Application No.: US15525622Application Date: 2016-06-03
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Publication No.: US10147744B2Publication Date: 2018-12-04
- Inventor: Hongfei Cheng , Jianbo Xian , Pan Li , Xueguang Hao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201620257716U 20160330
- International Application: PCT/CN2016/084702 WO 20160603
- International Announcement: WO2017/166428 WO 20171005
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1362 ; G02F1/1368 ; H01L27/32 ; H01L29/786 ; H01L33/00 ; H01L51/52

Abstract:
An array substrate, a method of manufacturing the same, and a display device are provided. In the array substrate of the present disclosure, the gate cutout is formed in the area where the gate line intersects the data line. The array substrate can reduce the coupling capacitance between the data line and the gate line. When the gate cutout extends beyond the area between the first thin film transistor and the second thin film transistor, the mutual interference between two thin film transistors of each pixel region can be further reduced.
Public/Granted literature
- US20180108676A1 ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE Public/Granted day:2018-04-19
Information query
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