Invention Grant
- Patent Title: Dicing method and laser processing apparatus
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Application No.: US15694984Application Date: 2017-09-04
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Publication No.: US10153206B2Publication Date: 2018-12-11
- Inventor: Tsutomu Fujita , Takanobu Ono
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2017-057716 20170323
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/268 ; H01L21/66 ; H01L21/67 ; B23K26/03 ; B23K26/08 ; B23K26/364 ; H01L21/683
Abstract:
According to one embodiment, a dicing method is provided. The dicing method includes detecting a first distance between a first portion of a substrate and a first substrate information detection unit. The method also includes detecting a second distance between a second portion of the substrate a second substrate information detection unit, the second portion different from the first portion. Distance information is calculated between the substrate and a processing lens, which is located farther from the second substrate information detection unit than from the first substrate information detection unit, based on the detected first distance and the detected second distance, and he substrate is irradiated with laser light from the processing lens based on the distance information.
Public/Granted literature
- US20180277435A1 DICING METHOD AND LASER PROCESSING APPARATUS Public/Granted day:2018-09-27
Information query
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