Invention Grant
- Patent Title: Integrated circuit device and method of fabricating the same
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Application No.: US15390361Application Date: 2016-12-23
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Publication No.: US10153277B2Publication Date: 2018-12-11
- Inventor: Yong-suk Tak , Tae-jong Lee , Gi-gwan Park , Ji-myoung Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0012449 20160201
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L21/8234 ; H01L27/088 ; H01L21/02 ; H01L27/02 ; H01L29/08 ; H01L29/423 ; H01L21/8258

Abstract:
An integrated circuit device includes: a pair of width-setting patterns over a substrate, the pair of width-setting patterns defining a width of a gate structure space in a first direction and extending in a second direction intersecting with the first direction. A gate electrode layer is provided that extends in the gate structure space along the second direction. A gate insulating layer is provided in the gate structure space and between the substrate and the gate electrode layer. An insulating spacer is provides on the pair of width-setting patterns, the insulating spacer covering both sidewalls of the gate electrode layer, wherein the pair of width-setting patterns have a carbon content that is greater than a carbon content of the insulating spacer.
Public/Granted literature
- US20170221893A1 INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-08-03
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