Invention Grant
- Patent Title: Semiconductor device, power supply circuit, computer, and method of manufacturing semiconductor device
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Application No.: US15695292Application Date: 2017-09-05
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Publication No.: US10153347B2Publication Date: 2018-12-11
- Inventor: Tatsuo Shimizu , Hisashi Saito , Hiroshi Ono
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-005807 20170117
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/20 ; H01L29/66 ; H01L29/778 ; H01L29/205

Abstract:
A semiconductor device includes a first nitride semiconductor layer containing Ga, a second nitride semiconductor layer provided on the first nitride semiconductor layer containing Ga, a first electrode and a second electrode provided on or above the first nitride semiconductor layer and electrically connected to the first nitride semiconductor layer, a gate electrode provided between the first electrode and the second electrode, a conductive layer provided on or above the second electrode, of which a first distance to the second electrode is smaller than a second distance between the second electrode and the gate electrode, and which is electrically connected to the first electrode or the gate electrode, a first aluminum oxide layer provided between the gate electrode and the second electrode and provided between the second nitride semiconductor layer and the conductive layer, a silicon oxide layer, and a second aluminum oxide layer.
Public/Granted literature
- US20180204916A1 SEMICONDUCTOR DEVICE, POWER SUPPLY CIRCUIT, COMPUTER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-07-19
Information query
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