Invention Grant
- Patent Title: Electronic assembly group and method for producing the same
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Application No.: US15375578Application Date: 2016-12-12
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Publication No.: US10154593B2Publication Date: 2018-12-11
- Inventor: Thomas Gottwald , Christian Rössle
- Applicant: Schweizer Electronic AG
- Applicant Address: DE Schramburg
- Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee Address: DE Schramburg
- Agency: Shlesinger, Arkwright & Garvey LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H01L23/64 ; H02K9/22 ; H05K3/46 ; H02K11/30 ; H02K11/33 ; H05K1/02 ; H05K3/30 ; H01G2/06 ; H05K3/00 ; H05K3/34 ; H05K3/40 ; H01L23/00
Abstract:
An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.
Public/Granted literature
- US20170127524A1 Electronic Assembly Group and Method for Producing the Same Public/Granted day:2017-05-04
Information query
