Invention Grant
- Patent Title: Financier-facilitated guaranty provisioning
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Application No.: US14167637Application Date: 2014-01-29
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Publication No.: US10157407B2Publication Date: 2018-12-18
- Inventor: Edward K. Y. Jung , Richard T. Lord , Robert W. Lord
- Applicant: Elwha LLC, a limited liability corporation of the State of Delaware
- Applicant Address: US WA Bellevue
- Assignee: Elwha LLC
- Current Assignee: Elwha LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: G06Q30/00
- IPC: G06Q30/00 ; G06Q30/06 ; H04L29/06

Abstract:
Disclosed herein are example embodiments for financier-facilitated guaranty provisioning. For certain example embodiments, at least one device, such as a server device of a financier: (i) may discover at least one authorization request corresponding to at least one product transaction; or (ii) may provide at least one proffered guaranty transaction to at least one guarantor. However, claimed subject matter is not limited to any particular described embodiments, implementations, examples, or so forth.
Public/Granted literature
- US20150120501A1 FINANCIER-FACILITATED GUARANTY PROVISIONING Public/Granted day:2015-04-30
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