Invention Grant
- Patent Title: Vertically integrated image sensor chips and methods for forming the same
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Application No.: US15845049Application Date: 2017-12-18
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Publication No.: US10157958B2Publication Date: 2018-12-18
- Inventor: Jeng-Shyan Lin , Feng-Chi Hung , Dun-Nian Yaung , Jen-Cheng Liu , Szu-Ying Chen , Wen-De Wang , Tzu-Hsuan Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via.
Public/Granted literature
- US20180108703A1 Vertically Integrated Image Sensor Chips and Methods for Forming the Same Public/Granted day:2018-04-19
Information query
IPC分类:
