Invention Grant
- Patent Title: Charge compensation semiconductor devices
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Application No.: US15682874Application Date: 2017-08-22
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Publication No.: US10157982B2Publication Date: 2018-12-18
- Inventor: Daniel Tutuc , Christian Fachmann , Franz Hirler , Maximilian Treiber
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016115806 20160825
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/225 ; H01L21/265 ; H01L21/324 ; H01L29/10 ; H01L29/66 ; H01L29/78

Abstract:
A field-effect semiconductor device includes a semiconductor body having a first semiconductor region of a first conductivity type, a first side, an edge delimiting the semiconductor body in a direction substantially parallel to the first side, an active area, and a peripheral area arranged between the active area and the edge. A first metallization is arranged on the first side, and a second metallization is arranged opposite the first metallization and in Ohmic connection with the first semiconductor region. In the active area, the semiconductor body further includes: a plurality of drift portions of the first conductivity type alternating with compensation regions of a second conductivity type, the drift portions being in Ohmic connection with the first semiconductor region, the compensation regions being in Ohmic connection with the first metallization and having in a vertical direction perpendicular to the first side a vertical extension.
Public/Granted literature
- US20180061937A1 Charge Compensation Semiconductor Devices Public/Granted day:2018-03-01
Information query
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