Invention Grant
- Patent Title: Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer
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Application No.: US15578701Application Date: 2016-06-01
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Publication No.: US10159142B2Publication Date: 2018-12-18
- Inventor: Yuusuke Haruna , Hiroshi Tajima , Masahiro Watanabe , Yukari Kobayashi , Kiyoharu Sekiguchi , Yoshihiro Hosoya
- Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD. , TOKUSHU KINZOKU EXCEL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Potomac Law Group, PLLC
- Priority: JP2015-112296 20150602
- International Application: PCT/JP2016/066190 WO 20160601
- International Announcement: WO2016/194950 WO 20161208
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B23K20/02 ; B23K20/00 ; B23K20/24 ; B23K35/00 ; B23K35/02 ; B23K1/19 ; H05K3/32 ; H05K1/09 ; H05K1/18 ; B23K20/16 ; B23K20/227 ; B23K101/42 ; B23K103/04 ; B23K103/18
Abstract:
A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.
Public/Granted literature
- US20180103540A1 PRINTED WIRING BOARD, PRINTED WIRING BOARD REINFORCING MEMBER, AND PRINTED CIRCUIT BOARD Public/Granted day:2018-04-12
Information query
