Invention Grant
- Patent Title: Heat dissipating structure
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Application No.: US15520604Application Date: 2015-04-13
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Publication No.: US10159166B2Publication Date: 2018-12-18
- Inventor: Kosuke Ikeda , Yuji Morinaga , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Priority: WOPCT/JP2014/078744 20141029
- International Application: PCT/JP2015/061323 WO 20150413
- International Announcement: WO2016/067659 WO 20160506
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/367 ; F28F13/08 ; H01L25/07 ; H01L23/36 ; H01L25/18 ; H05K7/00 ; H05K7/10 ; H01R12/70 ; F28F13/00

Abstract:
A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.
Public/Granted literature
- US20170311482A1 HEAT DISSIPATING STRUCTURE Public/Granted day:2017-10-26
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