Invention Grant
- Patent Title: Semiconductor device, method and tool of manufacture
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Application No.: US15284162Application Date: 2016-10-03
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Publication No.: US10163642B2Publication Date: 2018-12-25
- Inventor: Chih-Teng Liao , Tzu-Chan Weng , Yi-Wei Chiu , Chen Yung-Chan , Chia-Tsung Tso , Yu-Li Lin , Chun-Hung Liu , Kun-Cheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L29/66 ; H01L21/3065 ; H01L21/67 ; H01L21/683
Abstract:
A semiconductor manufacturing tool and process to form semiconductor devices is provided. An edge ring of the semiconductor manufacturing tool comprises a high electron mobility material in order to extend an electrical field and sheath such that curvature from the sheath is moved away from a semiconductor wafer so that an impact from the curvature is reduced or eliminated during an etching process.
Public/Granted literature
- US20180005832A1 Semiconductor Device, Method and Tool of Manufacture Public/Granted day:2018-01-04
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