Invention Grant
- Patent Title: Structure and method for overlay marks
-
Application No.: US15371465Application Date: 2016-12-07
-
Publication No.: US10163738B2Publication Date: 2018-12-25
- Inventor: Hsien-Cheng Wang , Ming-Chang Wen , Chun-Kuang Chen , Yao-Ching Ku
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/66 ; H01L29/66 ; H01L21/265 ; H01L29/51

Abstract:
A partially fabricated semiconductor device includes a semiconductor overlay structure. The semiconductor overlay structure includes a first gate stack structure over the semiconductor substrate, the first gate stack structure being configured as an overlay mark in an overlay region of the semiconductor substrate. The semiconductor overlay structure further includes a doped region in the semiconductor substrate surrounding the first gate stack structure. The doped region has a first dopant concentration greater than or equal to a second dopant concentration next to a second gate stack structure in a device region of the semiconductor substrate.
Public/Granted literature
- US20170084506A1 STRUCTURE AND METHOD FOR OVERLAY MARKS Public/Granted day:2017-03-23
Information query
IPC分类: