Invention Grant
- Patent Title: Package structure and method for forming the same
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Application No.: US15200747Application Date: 2016-07-01
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Publication No.: US10163805B2Publication Date: 2018-12-25
- Inventor: Cheng-Hsien Hsieh , Li-Han Hsu , Wei-Cheng Wu , Hsien-Wei Chen , Der-Chyang Yeh , Chi-Hsi Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/31 ; H01L23/528 ; H01L23/00 ; H01L21/56 ; H01L21/683
Abstract:
A package structure and method for forming the same are provided. The package structure includes a substrate and a package layer formed over the substrate. The package structure further includes an alignment structure formed over the package layer, and the alignment structure includes a first alignment mark formed in a trench, and the trench has a step-shaped structure.
Public/Granted literature
- US20180005955A1 PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-01-04
Information query
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