Invention Grant
- Patent Title: Electromagnetic interference shielding for system-in-package technology
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Application No.: US14998089Application Date: 2015-12-26
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Publication No.: US10163810B2Publication Date: 2018-12-25
- Inventor: Eric J. Li , Yoshihiro Tomita , Nachiket R. Raravikar , Robert L. Sankman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H01L23/552 ; H01L25/065 ; H01L23/31 ; H01L23/538 ; H01L25/00 ; H01L21/78 ; H01L21/683 ; H01L21/311 ; H01L23/00
Abstract:
Embodiments are generally directed to electromagnetic interference shielding for system-in-package technology. An embodiment of a system-in-package includes a substrate; chips and components attached to the substrate; dielectric molding over the chips and components; and an electromagnetic interference (EMI) shield. The EMI shield formed from a conductive paste, and the EMI shield provides a combined internal EMI shield between chips and components of the system in package and external EMI shield for the system-in-package.
Public/Granted literature
- US20170186699A1 Electromagnetic interference shielding for system-in-package technology Public/Granted day:2017-06-29
Information query
