Invention Grant
- Patent Title: Structure and formation method of chip package with lid
-
Application No.: US15180404Application Date: 2016-06-13
-
Publication No.: US10163816B2Publication Date: 2018-12-25
- Inventor: Shu-Shen Yeh , Chin-Hua Wang , Kuang-Chun Lee , Po-Yao Lin , Shyue-Ter Leu , Shin-Puu Jeng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/04 ; H01L23/00 ; H01L23/498 ; H01L23/367
Abstract:
Structures and formation methods of a chip package are provided. The chip package includes a substrate and a semiconductor die over a surface of the substrate. The chip package also includes a lid over the semiconductor die. The lid has a number of support structures bonded with the substrate, and the lid has one or more openings between two of the support structures.
Public/Granted literature
- US20170358542A1 STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID Public/Granted day:2017-12-14
Information query
IPC分类:
