Invention Grant
- Patent Title: Methods of fluxless micro-piercing of solder balls, and resulting devices
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Application No.: US14201031Application Date: 2014-03-07
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Publication No.: US10163840B2Publication Date: 2018-12-25
- Inventor: Teck Kheng Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/60 ; H01L23/00 ; H01L21/48 ; H05K3/32 ; H05K3/40 ; H01L23/48 ; H05K3/06
Abstract:
A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.
Public/Granted literature
- US20150008577A1 METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES Public/Granted day:2015-01-08
Information query
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