Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15812953Application Date: 2017-11-14
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Publication No.: US10163855B2Publication Date: 2018-12-25
- Inventor: Jong Sik Paek , Doo Hyun Park
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0035939 20150316
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L25/00
Abstract:
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various electronic devices, and methods of making thereof, that comprise a permanently coupled carrier that enhances reliability of the electronic devices.
Public/Granted literature
- US20180076172A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-15
Information query
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