Invention Grant
- Patent Title: High voltage ESD protection apparatus
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Application No.: US15165832Application Date: 2016-05-26
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Publication No.: US10163891B2Publication Date: 2018-12-25
- Inventor: Yi-Feng Chang , Jam-Wem Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/73 ; H01L29/735 ; H01L29/861 ; H01L27/06 ; H01L29/06 ; H01L29/08 ; H01L29/10

Abstract:
A device comprises a high voltage n well and a high voltage p well over a buried layer, a first low voltage n well over the high voltage n well, wherein a bottom portion of the first low voltage n well is surrounded by the high voltage n well, an N+ region over the first low voltage n well, a second low voltage n well and a low voltage p well over the high voltage p well, a first P+ region over the second low voltage n well and a second P+ region over the low voltage p well.
Public/Granted literature
- US20160276334A1 High Voltage ESD Protection Apparatus Public/Granted day:2016-09-22
Information query
IPC分类: