Invention Grant
- Patent Title: Transistor with improved air spacer
-
Application No.: US15591278Application Date: 2017-05-10
-
Publication No.: US10164007B2Publication Date: 2018-12-25
- Inventor: Zhenxing Bi , Kangguo Cheng , Juntao Li , Peng Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini Bianco PL
- Agent Thomas S. Grzesik
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/06 ; H01L21/764 ; H01L29/40 ; H01L21/283 ; H01L29/78 ; H01L21/8234 ; H01L29/49 ; H01L23/528 ; H01L27/088 ; H01L29/423

Abstract:
A semiconductor structure and a method for fabricating the same. The semiconductor structure includes a gate stack disposed on a substrate. A gate contact is disposed in contact with an end portion of the gate stack. An air gap spacer is disposed in contact with a portion of the gate stack. The end portion of the gate stack is absent the air gap spacer. The method includes forming a gate contact in contact with a gate stack. A spacer surrounding at least a portion of the gate stack is removed after the gate contact has been formed. The removal of the spacer forms a trench surrounding the gate stack and stopping at the gate contact. An air gap spacer is formed within the trench.
Public/Granted literature
- US20180096990A1 TRANSISTOR WITH IMPROVED AIR SPACER Public/Granted day:2018-04-05
Information query
IPC分类: