Invention Grant
- Patent Title: FinFET device having a channel defined in a diamond-like shape semiconductor structure
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Application No.: US15357782Application Date: 2016-11-21
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Publication No.: US10164062B2Publication Date: 2018-12-25
- Inventor: You-Ru Lin , Cheng-Hsien Wu , Chih-Hsin Ko , Clement Hsingjen Wann
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/04 ; H01L21/02 ; H01L21/306 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L21/762 ; H01L29/06 ; H01L29/08

Abstract:
The present disclosure provides a FinFET device. The FinFET device comprises a semiconductor substrate of a first semiconductor material; a fin structure of the first semiconductor material overlying the semiconductor substrate, wherein the fin structure has a top surface of a first crystal plane orientation; a diamond-like shape structure of a second semiconductor material disposed over the top surface of the fin structure, wherein the diamond-like shape structure has at least one surface of a second crystal plane orientation; a gate structure disposed over the diamond-like shape structure, wherein the gate structure separates a source region and a drain region; and a channel region defined in the diamond-like shape structure between the source and drain regions.
Public/Granted literature
- US20170069736A1 FINFET Device Having a Channel Defined in a Diamond-Like Shape Semiconductor Structure Public/Granted day:2017-03-09
Information query
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