Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15412943Application Date: 2017-01-23
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Publication No.: US10164084B2Publication Date: 2018-12-25
- Inventor: Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JP2016-049743 20160314
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/16

Abstract:
A semiconductor device includes: an n+-type drain region made of a wide-bandgap semiconductor material; an n-type epitaxial layer provided on the top surface of the drain region; an n-type first semiconductor region provided at an upper portion of the epitaxial layer and having a higher impurity concentration than the epitaxial layer; an n-type second semiconductor region provided on the first semiconductor region and having a higher impurity concentration than the first semiconductor region; p-type base regions surrounding to include an upper portion in the middle of the second semiconductor region; n-type source regions provided at upper portions of the base regions to form a channel; and a gate electrode which controls a surface potentials of the channels.
Public/Granted literature
- US20170263745A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-09-14
Information query
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