A cooling mechanism used inside a gimbal includes a heat dissipating module, a main board and fasteners. The main board is fixed to a lower surface of the heat dissipating module through the fasteners. The main board includes a main chip. The heat dissipating module includes an upper sealing cover; a lower sealing cover fixedly connected to the upper sealing cover, wherein a lower surface of the lower sealing cover has a hole for accommodating the main chip; an air storehouse, wherein a bottom surface of the air storehouse contacts with the main chip, a side surface of the air storehouse is adjacent to a cooling chamber; and sealing rings located between the upper sealing cover and the lower sealing cover. A cooling chamber is formed by the upper sealing cover, the lower sealing cover and a baffle, the cooling liquid is provided in the cooling chamber.