- Patent Title: Resilient pad composite and process for making same without a die
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Application No.: US13922102Application Date: 2013-06-19
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Publication No.: US10166746B2Publication Date: 2019-01-01
- Inventor: Daniel Kim
- Applicant: Applied FT Composite Solutions Inc.
- Applicant Address: US NV Las Vegas
- Assignee: Applied FT Composite Solutions Inc.
- Current Assignee: Applied FT Composite Solutions Inc.
- Current Assignee Address: US NV Las Vegas
- Agency: JHK Law
- Agent Joseph Hyosuk Kim
- Main IPC: B32B37/02
- IPC: B32B37/02 ; B32B38/04 ; B32B38/00 ; F16F3/087 ; B32B3/18 ; B32B5/02 ; A41D31/00 ; B32B37/12

Abstract:
The present application describes making a resilient pad composite that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure. The reinforcing structure may include a lattice of reinforcing material. The one or more lattices of reinforcing material may engage at least some of the resilient elements.
Public/Granted literature
- US20180001610A9 RESILIENT PAD COMPOSITE AND PROCESS FOR MAKING SAME WITHOUT A DIE Public/Granted day:2018-01-04
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