Invention Grant
- Patent Title: Stress isolation platform for MEMS devices
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Application No.: US14502475Application Date: 2014-09-30
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Publication No.: US10167189B2Publication Date: 2019-01-01
- Inventor: Xin Zhang , Michael W. Judy , George M. Molnar , Christopher Needham , Kemiao Jia
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81B7/00
Abstract:
A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
Public/Granted literature
- US20160090297A1 Stress Isolation Platform for MEMS Devices Public/Granted day:2016-03-31
Information query
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