Invention Grant
- Patent Title: Reduction in large particle counts in polishing slurries
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Application No.: US15824234Application Date: 2017-11-28
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Publication No.: US10167415B2Publication Date: 2019-01-01
- Inventor: James McDonough , Laura John , Deepak Mahulikar
- Applicant: Fujifilm Planar Solutions, LLC
- Applicant Address: US AZ Mesa
- Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
- Current Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
- Current Assignee Address: US AZ Mesa
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321
Abstract:
The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
Public/Granted literature
- US20180079931A1 REDUCTION IN LARGE PARTICLE COUNTS IN POLISHING SLURRIES Public/Granted day:2018-03-22
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